boykisser
-LaserCutter
Simple project documenting my "lasercutter wet clay" shaping process.
The Process
While fooling around with technology I discovered that wet clay may be very easily manipulated using the common K40
40 W CO₂-Lasercutter.
This works essentially by vaporising the water very quickly and thus ablating huge portions of the clay at once.
The following usage modes are the ones already discovered by me:
-
fine mark
: power=100%
speed=20-60mm/s
inFocus=True
-
coarse mark
: power=100%
speed=5-15mm/s
inFocus=False
(3mm line width is no big deal!) -
engrave
: power=100%
speed=20-60mm/s
inFocus=True
-
vitrify
: power=100%
speed=4-12mm/s
inFocus=True
Note: For deep cuts one has to repeat the marking operation many many times, depending on thickness and speed setting as one iteration only removes a little material and going slower as one would with other material just results in the vitrification of the clay.
Licensing
For general licensing information see LICENSE
-file.
There is however one exception: The file boykisser-seeklogo.svg
comes from an external source where I wasn't able to determine the exact license.