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boykisser-LaserCutter

Simple project documenting my "lasercutter wet clay" shaping process.

The Process

While fooling around with technology I discovered that wet clay may be very easily manipulated using the common K40 40 W CO₂-Lasercutter.

This works essentially by vaporising the water very quickly and thus ablating huge portions of the clay at once.

The following usage modes are the ones already discovered by me:

  • fine mark: power=100% speed=20-60mm/s inFocus=True
  • coarse mark: power=100% speed=5-15mm/s inFocus=False (3mm line width is no big deal!)
  • engrave: power=100% speed=20-60mm/s inFocus=True
  • vitrify: power=100% speed=4-12mm/s inFocus=True

Note: For deep cuts one has to repeat the marking operation many many times, depending on thickness and speed setting as one iteration only removes a little material and going slower as one would with other material just results in the vitrification of the clay.

Licensing

For general licensing information see LICENSE-file.
There is however one exception: The file boykisser-seeklogo.svg comes from an external source where I wasn't able to determine the exact license.